Method of forming via hole, array substrate and method of forming the same and display device
Abstract:
The present disclosure provides a method of forming a via hole, an array substrate and a method of forming the same and a display device. The method of forming a via hole includes: forming a pattern of a first via hole and a pattern of an upper-part etched structure of a second via hole simultaneously on a base substrate through a first patterning process by using a first mask; forming a pattern of the second hole in a region corresponding to the formed pattern of the upper-part etched structure of the second via hole through a second patterning process by using a second mask.
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