- 专利标题: Semiconductor devices having isolation insulating layers and methods of manufacturing the same
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申请号: US15335743申请日: 2016-10-27
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公开(公告)号: US10204821B2公开(公告)日: 2019-02-12
- 发明人: HeonJong Shin , Sungmin Kim , Byungseo Kim , Sunhom Steve Paak , Hyunjun Bae
- 申请人: Samsung Electronics Co., Ltd.
- 申请人地址: KR
- 专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人: Samsung Electronics Co., Ltd.
- 当前专利权人地址: KR
- 代理机构: Myers Bigel, P.A.
- 优先权: KR10-2014-0010202 20140128; KR10-2014-0031713 20140318
- 主分类号: H01L21/762
- IPC分类号: H01L21/762 ; H01L29/66 ; H01L29/78 ; H01L27/088 ; H01L21/265 ; H01L21/324
摘要:
The inventive concepts provide semiconductor devices and methods of manufacturing the same. Semiconductor devices of the inventive concepts may include a fin region comprising a first fin subregion and a second fin subregion separated and isolated from each other by an isolation insulating layer disposed therebetween, a first gate intersecting the first fin subregion, a second gate intersecting the second fin subregion, and a third gate intersecting the isolation insulating layer.
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