Invention Grant
- Patent Title: Semiconductor devices having isolation insulating layers and methods of manufacturing the same
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Application No.: US15335743Application Date: 2016-10-27
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Publication No.: US10204821B2Publication Date: 2019-02-12
- Inventor: HeonJong Shin , Sungmin Kim , Byungseo Kim , Sunhom Steve Paak , Hyunjun Bae
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd.
- Current Assignee: Samsung Electronics Co., Ltd.
- Current Assignee Address: KR
- Agency: Myers Bigel, P.A.
- Priority: KR10-2014-0010202 20140128; KR10-2014-0031713 20140318
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L29/66 ; H01L29/78 ; H01L27/088 ; H01L21/265 ; H01L21/324

Abstract:
The inventive concepts provide semiconductor devices and methods of manufacturing the same. Semiconductor devices of the inventive concepts may include a fin region comprising a first fin subregion and a second fin subregion separated and isolated from each other by an isolation insulating layer disposed therebetween, a first gate intersecting the first fin subregion, a second gate intersecting the second fin subregion, and a third gate intersecting the isolation insulating layer.
Public/Granted literature
- US20170047243A1 SEMICONDUCTOR DEVICES HAVING ISOLATION INSULATING LAYERS AND METHODS OF MANUFACTURING THE SAME Public/Granted day:2017-02-16
Information query
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