Invention Grant
- Patent Title: Organic light emitting diode array substrate, method for manufacturing the same, packaging structure and display device
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Application No.: US15039639Application Date: 2015-11-17
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Publication No.: US10205116B2Publication Date: 2019-02-12
- Inventor: Liang Sun
- Applicant: BOE TECHNOLOGY GROUP CO., LTD.
- Applicant Address: CN Beijing
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.
- Current Assignee Address: CN Beijing
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: CN201410832038 20141226
- International Application: PCT/CN2015/094767 WO 20151117
- International Announcement: WO2016/101731 WO 20160630
- Main IPC: H01L35/24
- IPC: H01L35/24 ; H01L51/52 ; H01L27/32 ; H01L51/00

Abstract:
An OLED array substrate and a method for manufacturing the same, an OLED packaging structure and a display device are provided by the present disclosure. The OLED array substrate includes thin film transistors, anodes, cathodes and organic light-emitting layers arranged between the anodes and the cathodes. The OLED array substrate further includes spacers configured to support the OLED array substrate and a packaging substrate so as to form a cell gap therebetween. Each cathode includes a first region which covers the corresponding first spacer and a second region beyond the first regions, and a thickness of the cathode at the first region is larger than a thickness of the cathode at the second region.
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