Invention Grant
- Patent Title: Semiconductor structure with airgap
-
Application No.: US15812320Application Date: 2017-11-14
-
Publication No.: US10211087B2Publication Date: 2019-02-19
- Inventor: Mark D. Jaffe , Alvin J. Joseph , Qizhi Liu , Anthony K. Stamper
- Applicant: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Applicant Address: US NY Armonk
- Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee: INTERNATIONAL BUSINESS MACHINES CORPORATION
- Current Assignee Address: US NY Armonk
- Agency: Roberts Mlotkowski Safran Cole & Calderon, P.C.
- Agent Stephen Meyers; Andrew M. Calderon
- Main IPC: H01L21/762
- IPC: H01L21/762 ; H01L29/06 ; H01L29/78 ; H01L29/66 ; H01L21/265 ; H01L21/764 ; H01L21/306 ; H01L21/02 ; H01L21/027 ; H01L21/266

Abstract:
A field effect transistor (FET) with an underlying airgap and methods of manufacture are disclosed. The method includes forming an amorphous layer at a predetermined depth of a substrate. The method further includes forming an airgap in the substrate under the amorphous layer. The method further includes forming a completely isolated transistor in an active region of the substrate, above the amorphous layer and the airgap.
Public/Granted literature
- US20180068887A1 SEMICONDUCTOR STRUCTURE WITH AIRGAP Public/Granted day:2018-03-08
Information query
IPC分类: