Invention Grant
- Patent Title: Semiconductor device and a manufacturing method thereof
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Application No.: US15914196Application Date: 2018-03-07
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Publication No.: US10211348B2Publication Date: 2019-02-19
- Inventor: Atsushi Amo
- Applicant: Renesas Electronics Corporation
- Applicant Address: JP Tokyo
- Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee: RENESAS ELECTRONICS CORPORATION
- Current Assignee Address: JP Tokyo
- Agency: Shapiro, Gabor and Rosenberger, PLLC
- Priority: JP2015-048719 20150311
- Main IPC: H01L29/94
- IPC: H01L29/94 ; H01L27/06 ; H01L29/66 ; H01L29/423 ; H01L27/11573 ; G11C16/04 ; H01L29/792

Abstract:
In a semiconductor device including a split gate type MONOS memory, and a trench capacitor element having an upper electrode partially embedded in trenches formed in the main surface of a semiconductor substrate, merged therein, the flatness of the top surface of the upper electrode embedded in the trench is improved. The polysilicon film formed over the semiconductor substrate to form a control gate electrode forming a memory cell of the MONOS memory is embedded in the trenches formed in the main surface of the semiconductor substrate in a capacitor element formation region, thereby to form the upper electrode including the polysilicon film in the trenches.
Public/Granted literature
- US20180198001A1 SEMICONDUCTOR DEVICE AND A MANUFACTURING METHOD THEREOF Public/Granted day:2018-07-12
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