Invention Grant
- Patent Title: Flexible substrate with integrated circuit
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Application No.: US14863902Application Date: 2015-09-24
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Publication No.: US10214019B2Publication Date: 2019-02-26
- Inventor: Iain Campbell-Brown , Mark Walsh , John Oliver , Jefferson P. Ward , Amy Shipman
- Applicant: Hewlett-Packard Development Company, L.P.
- Applicant Address: US TX Houston
- Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee: Hewlett-Packard Development Company, L.P.
- Current Assignee Address: US TX Houston
- Agency: HP Inc. Patent Department
- Main IPC: H01R12/77
- IPC: H01R12/77 ; H01R43/20 ; B41J2/175
Abstract:
Example circuits and methods are described involving a flexible substrate for a fluid cartridge, comprising an integrated circuit connected to the flexible substrate, and electrical connector pads arranged on the flexible substrate for connection to the integrated circuit.
Public/Granted literature
- US20160036150A1 FLEXIBLE SUBSTRATE WITH INTEGRATED CIRCUIT Public/Granted day:2016-02-04
Information query
