Invention Grant
- Patent Title: Apparatus for micro pick and bond
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Application No.: US15283102Application Date: 2016-09-30
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Publication No.: US10217729B2Publication Date: 2019-02-26
- Inventor: Khaled Ahmed , Kunjal ShyamKumar Parikh , Peter Chang
- Applicant: Intel Corporation
- Applicant Address: US CA Santa Clara
- Assignee: Intel Corporation
- Current Assignee: Intel Corporation
- Current Assignee Address: US CA Santa Clara
- Agency: Schwabe, Williamson & Wyatt, P.C.
- Main IPC: H01L25/13
- IPC: H01L25/13 ; H01L25/075 ; H01L21/683 ; H01L23/00 ; H01L25/00

Abstract:
Embodiments of the invention include systems and methods for transferring micro LEDs. In an embodiment, the system for transferring micro LEDs, may include a donor substrate bank that is capable of supporting a plurality of donor substrates on which a plurality of micro LEDs are formed. In an embodiment, the donor substrate bank is moveable in the X, Y, and Z directions. In an embodiment, the system may also include a host substrate table that is capable of supporting a host substrate. The host substrate may include a plurality of segments. In an embodiment, the host substrate table is moveable in the X, Y, and Z directions. Embodiments of the invention may also include an array of macro transfer heads. In an embodiment, each macro transfer head may include a plurality of micro transfer heads.
Public/Granted literature
- US20180096977A1 APPARATUS FOR MICRO PICK AND BOND Public/Granted day:2018-04-05
Information query
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