Invention Grant
- Patent Title: Legacy device securitization using bump-in-the-wire security devices within a microgrid system
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Application No.: US14696822Application Date: 2015-04-27
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Publication No.: US10218675B2Publication Date: 2019-02-26
- Inventor: Apurva Mohan , Himanshu Khurana , Gregory Brainard , Scott Fischer
- Applicant: Honeywell International Inc.
- Applicant Address: US NJ Morris Plains
- Assignee: Honeywell International Inc.
- Current Assignee: Honeywell International Inc.
- Current Assignee Address: US NJ Morris Plains
- Agency: Brooks, Cameron & Huebsch, PLLC
- Main IPC: H04L29/06
- IPC: H04L29/06 ; G05B19/418 ; H02J4/00

Abstract:
Devices, methods, systems, and computer-readable media for legacy device securitization within a microgrid system are described herein. One or more embodiments include a system having a microgrid network with at least one remote network connection to a non-local network device and the network having at least one local legacy device in communication with the non-local network device and a bump-in-the-wire (BITW) security device between the local legacy device and the at least one remote connection.
Public/Granted literature
- US20150312216A1 LEGACY DEVICE SECURITIZATION WITHIN A MICROGRID SYSTEM Public/Granted day:2015-10-29
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