Invention Grant
- Patent Title: Polyamide resin composition
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Application No.: US15547904Application Date: 2016-03-02
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Publication No.: US10221312B2Publication Date: 2019-03-05
- Inventor: Miho Nakai , Shohei Kumazawa , Kenji Ikemoto
- Applicant: UNITIKA LTD.
- Applicant Address: JP Hyogo
- Assignee: Unitika Ltd.
- Current Assignee: Unitika Ltd.
- Current Assignee Address: JP Hyogo
- Agency: Fildes & Outland, P.C.
- Priority: JP2015-041353 20150303
- International Application: PCT/JP2016/056356 WO 20160302
- International Announcement: WO2016/140240 WO 20160909
- Main IPC: C08L77/02
- IPC: C08L77/02 ; C08L1/02 ; C08K7/02

Abstract:
Provided is a polyamide resin composition including 0.01 to 50 parts by mass of cellulose fiber in relation to 100 parts by mass of a polyamide resin, having a relative viscosity of 2.3 or more, and having an L-value, an a-value and a b-value in an Lab color space of 20 or more, 10 or less and 20 or less, respectively. The aforementioned polyamide resin composition is obtained by subjecting a polyamide resin composition having a relative viscosity of 2.2 or less to a solid phase polymerization.
Public/Granted literature
- US20180022920A1 POLYAMIDE RESIN COMPOSITION Public/Granted day:2018-01-25
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