A magnetic field sensor includes a lead frame, a semiconductor die having a first surface in which a magnetic field sensing element is disposed and a second surface attached to the lead frame, and a non-conductive mold material enclosing the die and at least a portion of the lead frame. The sensor may include a ferromagnetic mold material secured to a portion of the non-conductive mold material. An electromagnetic suppressor comprising a ferromagnetic material encloses a passive device spaced from the non-conductive mold material and coupled to a plurality of leads.