Invention Grant
- Patent Title: Methods for the continuous processing of substrates
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Application No.: US15689550Application Date: 2017-08-29
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Publication No.: US10236198B2Publication Date: 2019-03-19
- Inventor: Banqiu Wu , Nag B. Patibandla , Toshiaki Fujita , Ralf Hofmann , Pravin K. Narwankar , Jeonghoon Oh , Srinivas Satya , Li-Qun Xia
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Servilla Whitney LLC
- Main IPC: C23C16/458
- IPC: C23C16/458 ; H01L21/673 ; H01L21/677 ; C23C16/455 ; C23C16/54
Abstract:
Methods of processing a plurality of substrates using a processing chamber with bottom and top openings and a plurality of processing slots are provided. A substrate positioned on a carrier is loaded into a first end of a processing chamber body through the bottom opening. The carrier is moved through a plurality of processing slots to a top opening at a second end of the chamber body and then removed from the processing chamber through the top opening.
Public/Granted literature
- US20170365491A1 Continuous Substrate Processing System Public/Granted day:2017-12-21
Information query
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