Invention Grant
- Patent Title: Electronic package and fabrication method thereof
-
Application No.: US14998324Application Date: 2015-12-24
-
Publication No.: US10236227B2Publication Date: 2019-03-19
- Inventor: Lung-Shan Chuang , Ching-Wen Chiang , Tzung-Yen Wu , Chun-Hung Lu
- Applicant: Siliconware Precision Industries Co., Ltd.
- Applicant Address: TW Taichung
- Assignee: Siliconware Prescision Industries Co., Ltd.
- Current Assignee: Siliconware Prescision Industries Co., Ltd.
- Current Assignee Address: TW Taichung
- Agency: Mintz Levin Cohn Ferris Glovsky and Popeo, P.C.
- Agent Peter F. Corless; Steven M. Jensen
- Priority: TW104107154A 20150306
- Main IPC: H01L21/00
- IPC: H01L21/00 ; H01L23/053 ; H01L21/683 ; H01L21/78 ; H01L23/00 ; H01L23/498 ; H01L21/48 ; H01L23/14
Abstract:
An electronic package is provided, including a circuit portion, an electronic element disposed on the circuit portion and a lid member disposed on the circuit portion to cover the electronic element. A separation portion is formed between the lid member and the electronic element. The lid member facilitates to prevent warping of the overall package structure. The invention further provides a method for fabricating the electronic package.
Public/Granted literature
- US20160260644A1 Electronic package and fabrication method thereof Public/Granted day:2016-09-08
Information query
IPC分类:
