A wireless IC device includes an element body including first and second principal surfaces, an RFIC element buried in the element body, and an antenna coil disposed in the element body. The antenna coil includes a first wiring pattern provided on the second principal surface, a first metal pin reaching the first principal surface and the second principal surface, a second metal pin reaching the first principal surface and the second principal surface, and a second wiring pattern provided on the first principal surface. Terminal surfaces of the first input/output terminal and the second input/output terminal of the RFIC element face the second principal surface of the element body and are spaced away from the antenna coil while being connected to the first wiring pattern through first and second conductors extending from the second principal surface of the element body in a direction of the first primary surface.