Invention Grant
- Patent Title: Multi-power amplification
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Application No.: US15424603Application Date: 2017-02-03
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Publication No.: US10236838B2Publication Date: 2019-03-19
- Inventor: Wai Lim Ngai , Jeremy Goldblatt
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM Incorporated
- Current Assignee: QUALCOMM Incorporated
- Current Assignee Address: US CA San Diego
- Agency: Hunter Clark PLLC
- Main IPC: H03F3/21
- IPC: H03F3/21 ; H03F1/02 ; H03F3/19 ; H03F3/72

Abstract:
An amplification circuit includes: an input stage including a driver; a transformer that includes a primary winding and a secondary winding, the primary winding being coupled to an output of the driver; and an output stage including: an output configured to be coupled to a load; and a plurality of paths coupled to the output and coupled to respective taps of the secondary winding; where at least one of the plurality of paths comprises a power amplifier.
Public/Granted literature
- US20180226924A1 MULTI-POWER AMPLIFICATION Public/Granted day:2018-08-09
Information query
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