A molding packaging material excellent in interlaminar lamination strength is provided, in which it is possible to prevent deterioration of the interlaminar strength due to influences of electrolytes and also possible to prevent deterioration of the interlaminar strength due to influences of heat generation and/or expansion/contraction of the packaging material caused by repetition of charging/discharging. The molding packaging material of the present invention includes a heat resistant resin layer 2 as an outer layer, a polypropylene layer 3 as an inner layer, a metal foil layer 5 arranged between the heat resistant resin layer and the polypropylene layer, wherein at least an inner side surface of the metal foil layer 4 is subjected to a chemical conversion treatment, and the polypropylene layer 3 is laminated on the chemical conversion treatment surface of the metal foil layer via an adhesive layer 5, wherein the adhesive layer 5 is formed by applying an adhesive to the chemical conversion treatment surface of the inner side surface of the metal foil layer 4, the adhesive containing at least an organic solvent, a polyolefin resin having a carboxyl group in which the organic solvent is dissolved and an MFR measured at 130° C. is 5 g/10 min to 42 g/10 min, and a multifunctional isocyanate compound.