Invention Grant
- Patent Title: Gas control in process chamber
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Application No.: US15184670Application Date: 2016-06-16
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Publication No.: US10240232B2Publication Date: 2019-03-26
- Inventor: Qiwei Liang , Srinivas D. Nemani , Ellie Y. Yieh
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: Applied Materials, Inc.
- Current Assignee: Applied Materials, Inc.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan, LLP
- Main IPC: C23C16/455
- IPC: C23C16/455 ; C23C16/44

Abstract:
A process chamber is provided including a sidewall, a substrate support, and an exhaust vent disposed above the substrate support. A processing region is formed between the exhaust vent and substrate support, and the exhaust vent is coupled to an exhaust device configured to create a low pressure at the exhaust vent relative to the processing region. The process chamber further includes a gas ring including an annular shaped body having an inner surface that circumscribes an annular region. The gas ring further includes a plurality of first nozzles that are coupled to a first gas source and configured to deliver a first gas to the processing region. The gas ring further includes a plurality of second nozzles that are coupled to a second gas source and configured to deliver a second gas to the processing region.
Public/Granted literature
- US20160369395A1 GAS CONTROL IN PROCESS CHAMBER Public/Granted day:2016-12-22
Information query
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