- Patent Title: Ultrasonic probe, method of working the same, and mounting device
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Application No.: US14851040Application Date: 2015-09-11
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Publication No.: US10241089B2Publication Date: 2019-03-26
- Inventor: Hae-in Chung , Tae-kyung Kim , Su-kwang Lim
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2014-0122032 20140915
- Main IPC: G01N29/32
- IPC: G01N29/32 ; G01N29/24 ; A61B8/00
Abstract:
An ultrasonic probe, a method of operating the same, and a mounting device are provided. The ultrasonic probe includes a main body configured to transmit and receive ultrasound, a heat storage including a phase-change material configured to store heat being generated by the main body, and a display configured to display an amount of the stored heat.
Public/Granted literature
- US20160077059A1 ULTRASONIC PROBE, METHOD OF WORKING THE SAME, AND MOUNTING DEVICE Public/Granted day:2016-03-17
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