Invention Grant
- Patent Title: Semiconductor package, semiconductor device using the same and manufacturing method thereof
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Application No.: US15342138Application Date: 2016-11-03
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Publication No.: US10242927B2Publication Date: 2019-03-26
- Inventor: Wen-Sung Hsu , Shih-Chin Lin , Ming-Jen Hsiung
- Applicant: MEDIATEK Inc.
- Applicant Address: TW Hsin-Chu
- Assignee: MediaTek Inc.
- Current Assignee: MediaTek Inc.
- Current Assignee Address: TW Hsin-Chu
- Agency: Wolf, Greenfield & Sacks, P.C.
- Main IPC: H01L23/31
- IPC: H01L23/31 ; H01L25/065 ; H01L21/56 ; H01L21/304 ; H01L21/78 ; H01L23/498 ; H01L23/00
Abstract:
A semiconductor package includes a substrate, a first electronic component, a film and a package body. The first electronic component is disposed on the substrate and has an upper surface. The film is disposed on the upper surface of the first electronic component. The package body encapsulates the first electronic component and the film.
Public/Granted literature
- US20170194227A1 SEMICONDUCTOR PACKAGE, SEMICONDUCTOR DEVICE USING THE SAME AND MANUFACTURING METHOD THEREOF Public/Granted day:2017-07-06
Information query
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