- 专利标题： Semiconductor package, semiconductor device using the same and manufacturing method thereof
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申请号： US15342138申请日： 2016-11-03
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公开(公告)号： US10242927B2公开(公告)日： 2019-03-26
- 发明人: Wen-Sung Hsu , Shih-Chin Lin , Ming-Jen Hsiung
- 申请人： MEDIATEK Inc.
- 申请人地址： TW Hsin-Chu
- 专利权人： MediaTek Inc.
- 当前专利权人： MediaTek Inc.
- 当前专利权人地址： TW Hsin-Chu
- 代理机构： Wolf, Greenfield & Sacks, P.C.
- 主分类号： H01L23/31
- IPC分类号： H01L23/31 ; H01L25/065 ; H01L21/56 ; H01L21/304 ; H01L21/78 ; H01L23/498 ; H01L23/00
摘要：
A semiconductor package includes a substrate, a first electronic component, a film and a package body. The first electronic component is disposed on the substrate and has an upper surface. The film is disposed on the upper surface of the first electronic component. The package body encapsulates the first electronic component and the film.
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