发明授权
- 专利标题： Fan-out ball grid array package structure and process for manufacturing the same
-
申请号： US15655724申请日： 2017-07-20
-
公开(公告)号： US10242940B2公开(公告)日： 2019-03-26
- 发明人: Jung-Liang Yeh , Meng-Jen Wang , Tsung-Yueh Tsai , Chih-Ming Hung
- 申请人： Advanced Semiconductor Engineering, Inc.
- 申请人地址： TW Kaohsiung
- 专利权人： ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- 当前专利权人： ADVANCED SEMICONDUCTOR ENGINEERING, INC.
- 当前专利权人地址： TW Kaohsiung
- 代理机构： Foley & Lardner LLP
- 代理商 Cliff Z. Liu
- 主分类号： H01L23/498
- IPC分类号： H01L23/498 ; H01L23/31 ; H01L23/00 ; H01L25/18 ; G06K9/00 ; H01L21/56
摘要：
A surface mount structure comprises a redistribution structure, an electrical connection and an encapsulant. The redistribution structure has a first surface and a second surface opposite the first surface. The electrical connection is on the first surface of the redistribution structure. The encapsulant encapsulates the first surface of the redistribution structure and the electrical connection. A portion of the electrical connection is exposed by the encapsulant.
公开/授权文献
信息查询
IPC分类:
