Invention Grant
- Patent Title: OLED packaging structure and manufacturing method thereof and display device
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Application No.: US15217196Application Date: 2016-07-22
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Publication No.: US10243174B2Publication Date: 2019-03-26
- Inventor: Rui Li , Xianxue Duan
- Applicant: BOE TECHNOLOGY GROUP CO., LTD. , HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Applicant Address: CN Beijing CN Anhui
- Assignee: BOE TECHNOLOGY GROUP CO., LTD.,HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee: BOE TECHNOLOGY GROUP CO., LTD.,HEFEI BOE OPTOELECTRONICS TECHNOLOGY CO., LTD.
- Current Assignee Address: CN Beijing CN Anhui
- Agency: Harness, Dickey & Pierce, P.L.C.
- Priority: CN201610003612 20160104
- Main IPC: H01L51/52
- IPC: H01L51/52 ; H01L51/56 ; H01L51/00
Abstract:
The present disclosure provides an OLED packaging structure and a manufacturing method thereof, and a display device comprising the packaging structure. The OLED packaging structure comprises a first substrate, an OLED disposed on the surface of the first substrate, and a packaging layer covering the OLED, wherein the packaging layer comprises a heat dissipation layer.
Public/Granted literature
- US20170194595A1 OLED PACKAGING STRUCTURE AND MANUFACTURING METHOD THEREOF AND DISPLAY DEVICE Public/Granted day:2017-07-06
Information query
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