Invention Grant
- Patent Title: Packaging material for power storage device, and power storage device
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Application No.: US15447591Application Date: 2017-03-02
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Publication No.: US10243178B2Publication Date: 2019-03-26
- Inventor: Keitaro Kawakita
- Applicant: SHOWA DENKO PACKAGING CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: SHOWA DENKO PACKAGING CO., LTD.
- Current Assignee: SHOWA DENKO PACKAGING CO., LTD.
- Current Assignee Address: JP Kanagawa
- Agency: Millen, White, Zelano & Branigan, P.C.
- Agent William Nixon
- Priority: JP2016-40083 20160302
- Main IPC: H01M2/02
- IPC: H01M2/02 ; H01G11/82 ; H01G11/80

Abstract:
A packaging material 1 for a power storage device is configured to include a polyamide resin layer 2 as an outer layer, a polyolefin resin layer 3 as an inner layer, and an aluminum foil layer 4 arranged between both the layers. A thickness of the packaging material 1 for a power storage device is 90 μm or less, a tensile breaking strength of the packaging material for a power storage device is 110 N/15 mm width or more, and a tensile breaking elongation of the packaging material for a power storage device is 90% or more. This enables to provide a packaging material for a power storage device thin in thickness and light in weight which is capable of securing excellent formability even when deep shape forming is performed and also is high in mechanical strength and excellent in impact resistance.
Public/Granted literature
- US20170256758A1 PACKAGING MATERIAL FOR POWER STORAGE DEVICE, AND POWER STORAGE DEVICE Public/Granted day:2017-09-07
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