Invention Grant
- Patent Title: Cavity forming method for a sensor chip, manufacturing method thereof, chip and electronics apparatus
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Application No.: US15559407Application Date: 2015-12-15
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Publication No.: US10246323B2Publication Date: 2019-04-02
- Inventor: Mengjin Cai , Qinglin Song
- Applicant: Goertek, Inc.
- Applicant Address: CN Weifang, Shandong
- Assignee: GOERTEK, INC.
- Current Assignee: GOERTEK, INC.
- Current Assignee Address: CN Weifang, Shandong
- Agency: Hultquist, PLLC
- Agent Steven J. Hultquist
- Priority: CN201510210301 20150428
- International Application: PCT/CN2015/097503 WO 20151215
- International Announcement: WO2016/173268 WO 20161103
- Main IPC: H01L21/76
- IPC: H01L21/76 ; B81C1/00
Abstract:
A method for forming a cavity of a sensor chip. The method comprises forming a first groove (a2) on a substrate (a1); bonding a covering layer (a4) onto the substrate (a1) to cover the first groove (a2), thereby forming a cavity; and etching the covering layer (a4) to decrease a thickness of the covering layer. The method can implement a thinner thickness of a film, thereby improving the sensitivity of a sensor.
Public/Granted literature
- US20180086631A1 CAVITY FORMING METHOD FOR A SENSOR CHIP, MANUFACTURING METHOD THEREOF, CHIP AND ELECTRONICS APPARATUS Public/Granted day:2018-03-29
Information query
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