Invention Grant
- Patent Title: Polypeptide, anti-VEGF antibody, and anti-c-Met/anti-VEGF bispecific antibodies comprising the same
-
Application No.: US14869636Application Date: 2015-09-29
-
Publication No.: US10246507B2Publication Date: 2019-04-02
- Inventor: Seung Hyun Lee , Soo Yeon Jung , Bo Gyou Kim , Seung Ja Oh , Ji Min Lee
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Leydig, Voit & Mayer, Ltd.
- Priority: KR10-2014-0130561 20140929
- Main IPC: A61K39/395
- IPC: A61K39/395 ; C07K16/22 ; C07K16/28 ; C07K16/30

Abstract:
A polypeptide, an anti-VEGF antibody and an anti-c-Met/anti-VEGF bispecific antibody, which includes the polypeptide, a pharmaceutical composition including the antibody, and a method of treating cancer using the antibody.
Public/Granted literature
- US20160090427A1 POLYPEPTIDE, ANTI-VEGF ANTIBODY, AND ANTI-C-MET/ANTI-VEGF BISPECIFIC ANTIBODIES COMPRISING THE SAME Public/Granted day:2016-03-31
Information query