Invention Grant
- Patent Title: Plasma enhanced chemical vapor deposition of films for improved vertical etch performance in 3D NAND memory devices
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Application No.: US15063569Application Date: 2016-03-08
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Publication No.: US10246772B2Publication Date: 2019-04-02
- Inventor: Praket P. Jha , Allen Ko , Xinhai Han , Thomas Jongwan Kwon , Bok Hoen Kim , Byung Ho Kil , Ryeun Kim , Sang Hyuk Kim
- Applicant: Applied Materials, Inc.
- Applicant Address: US CA Santa Clara
- Assignee: APPLIED MATERIALS, INC.
- Current Assignee: APPLIED MATERIALS, INC.
- Current Assignee Address: US CA Santa Clara
- Agency: Patterson + Sheridan LLP
- Main IPC: C23C16/34
- IPC: C23C16/34 ; C23C16/40 ; H05H1/24 ; H01L21/02 ; C23C16/455 ; H01L21/311 ; H01L27/11556 ; H01L27/11582

Abstract:
A method for forming a high aspect ratio feature is disclosed. The method includes depositing one or more silicon oxide/silicon nitride containing stacks on a substrate by depositing a first film layer on the substrate from a first plasma and depositing a second film layer having a refractive index on the first film layer from a second plasma. A predetermined number of first film layers and second film layers are deposited on the substrate. The first film layer and the second film layer are either a silicon oxide layer or a silicon nitride layer and the first film layer is different from the second film layer. The method further includes depositing a third film layer from a third plasma and depositing a fourth film layer on the third film layer from a fourth plasma. The fourth film layer has a refractive index greater than the first refractive index.
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