Invention Grant
- Patent Title: Monolithically integrated system on chip for silicon photonics
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Application No.: US15810641Application Date: 2017-11-13
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Publication No.: US10248616B2Publication Date: 2019-04-02
- Inventor: Radhakrishnan L. Nagarajan , Chao Xu
- Applicant: INPHI CORPORATION
- Applicant Address: US CA Santa Clara
- Assignee: INPHI CORPORATION
- Current Assignee: INPHI CORPORATION
- Current Assignee Address: US CA Santa Clara
- Agency: Ogawa P.C.
- Agent Richard T. Ogawa
- Main IPC: G06F13/24
- IPC: G06F13/24 ; H04B10/80 ; H04B10/40 ; H04B10/556 ; H04B10/54 ; H04B10/516 ; H04B10/69 ; H04B14/02 ; G06F15/78 ; G06F13/42 ; G06F13/364 ; G06F13/40 ; H04L1/00 ; H04L25/03 ; G02B6/12 ; H04L27/00 ; H04L27/34 ; H04L5/14 ; H04L27/02 ; H04L27/18

Abstract:
The present invention provides an integrated system-on-chip device. The device is configured on a single silicon substrate member. The device has a data input/output interface provided on the substrate member. The device has an input/output block provided on the substrate member and coupled to the data input/output interface. The device has a signal processing block provided on the substrate member and coupled to the input/output block. The device has a driver module provided on the substrate member and coupled to the signal processing block. The device further includes a driver interface and coupled to the driver module and configured to be coupled to a silicon photonics device. In an example, a control block is configured to receive and send instruction(s) in a digital format to the communication block and is configured to receive and send signals in an analog format to communicate with the silicon photonics device.
Public/Granted literature
- US20180081856A1 MONOLITHICALLY INTEGRATED SYSTEM ON CHIP FOR SILICON PHOTONICS Public/Granted day:2018-03-22
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