Invention Grant
- Patent Title: Method of manufacturing a wiring structure of a head suspension
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Application No.: US15234670Application Date: 2016-08-11
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Publication No.: US10249331B2Publication Date: 2019-04-02
- Inventor: Hajime Arai
- Applicant: NHK SPRING CO., LTD.
- Applicant Address: JP Kanagawa
- Assignee: NHK SPRING CO., LTD.
- Current Assignee: NHK SPRING CO., LTD.
- Current Assignee Address: JP Kanagawa
- Agency: Norris McLaughlin, P.A.
- Priority: JP2011-241693 20111102
- Main IPC: G11B5/127
- IPC: G11B5/127 ; H04R31/00 ; G11B5/48 ; H05K1/18 ; H05K1/02 ; H05K3/00 ; H05K3/18 ; H05K1/05

Abstract:
A wiring structure of a head suspension including a flexure that supports a head and is attached to a load beam applying load onto the head, comprises write wiring and read wiring formed on the flexure and connected to the head, each having wires of opposite polarities, and further including a stacked interleaved part includes segments electrically connected to the respective wires of the write wiring, the segments stacked on and facing the wires through an electrical insulating layer so that the facing wire and segment have opposite polarities.
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