Invention Grant
- Patent Title: Buildup board structure
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Application No.: US15086333Application Date: 2016-03-31
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Publication No.: US10256028B2Publication Date: 2019-04-09
- Inventor: Ting-Hao Lin , Chiao-Cheng Chang , Yi-Nong Lin
- Applicant: KINSUS INTERCONNECT TECHNOLOGY CORP.
- Applicant Address: TW Taoyuan
- Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.
- Current Assignee: KINSUS INTERCONNECT TECHNOLOGY CORP.
- Current Assignee Address: TW Taoyuan
- Agency: Idea Intellectual Limited
- Agent Margaret A. Burke; Sam T. Yip
- Main IPC: H01F27/28
- IPC: H01F27/28 ; H05K1/03 ; H05K1/11 ; H05K1/16 ; H05K3/46

Abstract:
A buildup board structure incorporating magnetic induction coils and flexible boards is disclosed. The buildup board structure includes at least one first, second and third buildup bodies modular and stackable. Any two adjacent buildup bodies are separated by a covering layer provided with a central hole for electrical insulation. All central holes are aligned. Each buildup body includes a plurality of flexible boards, and each flexible board is embedded with a plurality of magnetic induction coils surrounding the corresponding central hole and connected through connection pads. The first, second and third buildup bodies are easily laminated in any order by any number as desired such that the effect of magnetic induction provided by the magnetic induction coils embedded in the buildup board structure are addable to greatly enhance the overall effect of magnetic induction.
Public/Granted literature
- US20170287617A1 BUILDUP BOARD STRUCTURE Public/Granted day:2017-10-05
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