Buildup board structure
Abstract:
A buildup board structure incorporating magnetic induction coils and flexible boards is disclosed. The buildup board structure includes at least one first, second and third buildup bodies modular and stackable. Any two adjacent buildup bodies are separated by a covering layer provided with a central hole for electrical insulation. All central holes are aligned. Each buildup body includes a plurality of flexible boards, and each flexible board is embedded with a plurality of magnetic induction coils surrounding the corresponding central hole and connected through connection pads. The first, second and third buildup bodies are easily laminated in any order by any number as desired such that the effect of magnetic induction provided by the magnetic induction coils embedded in the buildup board structure are addable to greatly enhance the overall effect of magnetic induction.
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