Invention Grant
- Patent Title: Method of manufacturing semiconductor device
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Application No.: US14614970Application Date: 2015-02-05
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Publication No.: US10256291B2Publication Date: 2019-04-09
- Inventor: Akiharu Miyanaga
- Applicant: Semiconductor Energy Laboratory Co., Ltd.
- Applicant Address: JP Kanagawa-ken
- Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee: Semiconductor Energy Laboratory Co., Ltd.
- Current Assignee Address: JP Kanagawa-ken
- Agency: Robinson Intellectual Property Law Office
- Agent Eric J. Robinson
- Priority: JP2009-168650 20090717
- Main IPC: H01L27/12
- IPC: H01L27/12 ; H01L29/04 ; H01L29/66 ; H01L29/786 ; H01L21/00

Abstract:
An object is to provide a method for manufacturing a highly reliable semiconductor device including a transistor with stable electric characteristics. A method for manufacturing a semiconductor device includes the steps of: forming a gate electrode over a substrate having an insulating surface; forming a gate insulating film over the gate electrode; forming an oxide semiconductor film over the gate insulating film; irradiating the oxide semiconductor film with an electromagnetic wave such as a microwave or a high frequency; forming a source electrode and a drain electrode over the oxide semiconductor film irradiated with the electromagnetic wave; and forming an oxide insulating film, which is in contact with part of the oxide semiconductor film, over the gate insulating film, the oxide semiconductor film, the source electrode, and the drain electrode.
Public/Granted literature
- US20150144947A1 METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE Public/Granted day:2015-05-28
Information query
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