A memory device according to an embodiment includes a first conductive layer; a second conductive layer; a first metal oxide layer that is provided between the first conductive layer and the second conductive layer and includes at least one first metal element selected from the group consisting of aluminum (Al), gallium (Ga), zirconium (Zr), and hafnium (Hf); and a second metal oxide layer that is provided between the first metal oxide layer and the second conductive layer and includes at least one second metal element selected from the group consisting of zinc (Zn), titanium (Ti), tin (Sn), vanadium (V), niobium (Nb), tantalum (Ta), and tungsten (W). The first metal oxide layer includes a third metal element. The third metal element has a lower valence than a metal element having the highest atomic percent in the first metal oxide layer among the at least one first metal element.