Invention Grant
- Patent Title: Hybrid photonic plasmonic interconnects (HyPPI) with intrinsic and extrinsic modulation options
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Application No.: US15194119Application Date: 2016-06-27
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Publication No.: US10256600B2Publication Date: 2019-04-09
- Inventor: Shuai Sun , Volker J. Sorger , Tarek El-Ghazawi , Vikram K. Narayana , Abdel-Hameed A. Badawy
- Applicant: The George Washington University
- Applicant Address: US DC Washington
- Assignee: The George Washington University
- Current Assignee: The George Washington University
- Current Assignee Address: US DC Washington
- Agency: Blank Rome LLP
- Main IPC: H01S5/00
- IPC: H01S5/00 ; H01S5/10 ; H01S5/042 ; G02B6/12

Abstract:
The Hybrid Photonic Plasmonic Interconnect (HyPPI) combines both low loss photonic signal propagation and passive routing with ultra-compact plasmonic devices. These optical interconnects therefore uniquely combine fast operational data-bandwidths (in hundreds of Gbps) for light manipulation with low optical attenuation losses by hybridizing low loss photonics with strong light-matter-interaction plasmonics to create, modulate, switch and detect light efficiently at the same time. Initial implementations were considered for on-chip photonic integration, but also promising for free space or fiber-based systems. In general two technical options exist, which distinguished by the method the electric-optic conversion is executed: the extrinsic modulation method consists of an continuous wave source such as an LED or laser operating at steady power output, and signal encoding is done via an electro-optic modulator downstream of the source in the interconnect. In contrast, in the intrinsic method, the optical source is directly amplitude modulated.
Public/Granted literature
- US20170302053A1 HYBRID PHOTONIC PLASMONIC INTERCONNECTS (HYPPI) WITH INTRINSIC AND EXTRINSIC MODULATION OPTIONS Public/Granted day:2017-10-19
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