Invention Grant
- Patent Title: Earphone
-
Application No.: US15123987Application Date: 2016-05-11
-
Publication No.: US10257600B2Publication Date: 2019-04-09
- Inventor: Kuan-Hong Hsieh , Yonghui Hu , Qianlong Liu
- Applicant: 1MORE Inc.
- Applicant Address: CN Shenzhen, Guangdong Province
- Assignee: 1MORE INC.
- Current Assignee: 1MORE INC.
- Current Assignee Address: CN Shenzhen, Guangdong Province
- Agent Cheng-Ju Chiang
- Priority: CN201520733973U 20150921
- International Application: PCT/CN2016/081644 WO 20160511
- International Announcement: WO2017/049910 WO 20170330
- Main IPC: H04R1/10
- IPC: H04R1/10 ; H04R1/28

Abstract:
An earphone includes a housing having a sound output hole, wherein a center axis line of the sound output hole is deviated from a center axis line of the housing by an angle; a drive unit received inside the housing; and a resilient element disposed on the housing, wherein the resilient element can be squeezed and deformed, the resilient element or the housing abuts a cavum conchae of a user.
Public/Granted literature
- US20170264986A1 EARPHONE Public/Granted day:2017-09-14
Information query