Invention Grant

  • Patent Title: Earphone
  • Application No.: US15123987
    Application Date: 2016-05-11
  • Publication No.: US10257600B2
    Publication Date: 2019-04-09
  • Inventor: Kuan-Hong HsiehYonghui HuQianlong Liu
  • Applicant: 1MORE Inc.
  • Applicant Address: CN Shenzhen, Guangdong Province
  • Assignee: 1MORE INC.
  • Current Assignee: 1MORE INC.
  • Current Assignee Address: CN Shenzhen, Guangdong Province
  • Agent Cheng-Ju Chiang
  • Priority: CN201520733973U 20150921
  • International Application: PCT/CN2016/081644 WO 20160511
  • International Announcement: WO2017/049910 WO 20170330
  • Main IPC: H04R1/10
  • IPC: H04R1/10 H04R1/28
Earphone
Abstract:
An earphone includes a housing having a sound output hole, wherein a center axis line of the sound output hole is deviated from a center axis line of the housing by an angle; a drive unit received inside the housing; and a resilient element disposed on the housing, wherein the resilient element can be squeezed and deformed, the resilient element or the housing abuts a cavum conchae of a user.
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