The invention relates to a method for epilamization of at least one portion of a substrate surface comprising the steps of: a) preparing an epilame agent b) optionally, preparing the substrate surface c) placing the substrate and the epilame agent in a chamber at ambient pressure d) introducing CO2 into the hermetically sealed chamber at a pressure comprised between 25 bar and 74 bar and at a temperature comprised between 10° C. and 80° C. for a duration comprised between 1 minute and 30 minutes, e) reducing the pressure in the chamber, and f) removing the epilamized substrate from the chamber.