- 专利标题: Semiconductor module
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申请号: US15543922申请日: 2015-12-30
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公开(公告)号: US10262921B2公开(公告)日: 2019-04-16
- 发明人: Mika Lohtander , Leevi Paajanen , Tapani Siivo , Antti Jortikka , Hannu Ylisiurua , Emma Paasonen , Jyrki Montonen
- 申请人: LAPPEENRANNAN TEKNILLINEN YLIOPISTO
- 申请人地址: FI Lappeenranta
- 专利权人: LAPPEENRANNAN TEKNILLINEN YLIOPISTO
- 当前专利权人: LAPPEENRANNAN TEKNILLINEN YLIOPISTO
- 当前专利权人地址: FI Lappeenranta
- 代理机构: Young & Thompson
- 优先权: FI20155031 20150115
- 国际申请: PCT/FI2015/050958 WO 20151230
- 国际公布: WO2016/113461 WO 20160721
- 主分类号: H01L23/473
- IPC分类号: H01L23/473 ; H01L23/04 ; H01L23/10 ; H01L21/48 ; H01L23/053
摘要:
A semiconductor module includes a baseplate, a cover element attached to the baseplate so that detaching the cover element from the baseplate requires material deformations, and a semiconductor element in a room defined by the baseplate and the cover element. The semiconductor element is in a heat conductive relation with the baseplate and an outer surface of the baseplate is provided with laser machined grooves suitable for conducting heat transfer fluid. The laser machining makes it possible to make the grooves after the semiconductor module has been assembled. Therefore, regular commercially available semiconductor modules can be modified, with the laser machining, to semiconductor modules as disclosed.
公开/授权文献
- US20180012822A1 A SEMICONDUCTOR MODULE 公开/授权日:2018-01-11
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