Invention Grant
- Patent Title: Semiconductor packages
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Application No.: US15868411Application Date: 2018-01-11
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Publication No.: US10262967B2Publication Date: 2019-04-16
- Inventor: Tae-Joo Hwang , Eun-Seok Song
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR Suwon-si
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si
- Agency: Sughrue Mion, PLLC
- Priority: KR10-2017-0103698 20170816
- Main IPC: H01L23/485
- IPC: H01L23/485 ; H01L21/02 ; H01L25/10 ; H01L23/00 ; H01L23/522 ; H01L49/02 ; H01L23/31

Abstract:
A semiconductor package can include a mold substrate having opposite first and second surfaces where a semiconductor chip can be embedded inside the mold substrate. The semiconductor chip can include chip pads where a redistribution layer can be on the first surface of the mold substrate, and the redistribution layer can include redistribution lines therein electrically connected to the chip pads and can include a capacitor redistribution line. A capacitor can include a first electrode including a plurality of conductive pillars connected to the capacitor redistribution line. A dielectric layer can be on the first electrode and a second electrode can be on the dielectric layer.
Public/Granted literature
- US20190057949A1 SEMICONDUCTOR PACKAGES Public/Granted day:2019-02-21
Information query
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