Invention Grant
- Patent Title: Electrical contact pad for electrically contacting a connector
-
Application No.: US15617767Application Date: 2017-06-08
-
Publication No.: US10263352B2Publication Date: 2019-04-16
- Inventor: Graham Harry Smith, Jr. , Scott Eric Walton , Michael Frank Cina
- Applicant: TE Connectivity Corporation
- Applicant Address: US PA Berwyn
- Assignee: TE CONNECTIVITY CORPORATION
- Current Assignee: TE CONNECTIVITY CORPORATION
- Current Assignee Address: US PA Berwyn
- Main IPC: H05K1/00
- IPC: H05K1/00 ; H01R12/71 ; H01R12/70 ; H01R13/6474 ; H05K1/11 ; H01R12/72 ; H01P5/02 ; H05K1/02 ; H05K3/40

Abstract:
An electrical contact pad for electrically contacting a connector includes a first region having a first length in a longitudinal direction, and a second region having a second length in the longitudinal direction that is greater than the first length. The first region is arranged to contact a first arm of the connector and the second region is arranged to contact a second arm of the connector. The first length being smaller than the second length results in a beneficial increases the impedance of the electrical contact pad. A chamfered edge of the contact pad results in an additional beneficial increase in the impedance of the electrical contact pad.
Public/Granted literature
- US20170358878A1 ELECTRICAL CONTACT PAD FOR ELECTRICALLY CONTACTING A CONNECTOR Public/Granted day:2017-12-14
Information query