Invention Grant
- Patent Title: Multi-chip millimeter-wave interface
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Application No.: US15199692Application Date: 2016-06-30
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Publication No.: US10263652B2Publication Date: 2019-04-16
- Inventor: Bevin George Perumana , Saikat Sarkar , Tirdad Sowlati
- Applicant: Broadcom Corporation
- Applicant Address: SG Singapore
- Assignee: Avago Technologies International Sales PTE. Limited
- Current Assignee: Avago Technologies International Sales PTE. Limited
- Current Assignee Address: SG Singapore
- Agency: Morgan, Lewis & Bockius LLP
- Main IPC: H04B1/04
- IPC: H04B1/04 ; H01L23/66 ; H04B7/06

Abstract:
Systems and methods are provided for millimeter-wave (MMW) communication, the system includes a transceiver chip to generate and to receive signals. An interface is used to communicate the signals between the transceiver chip and one or more active antenna modules. The signals include modulated MMW signals and control signals. The transceiver chip includes baseband circuitry, up and down conversion mixers, and RF front-end circuitry. An active antenna module receives a first modulated MMW signal from the interface for transmission via antennas and to receive a second modulated MMW signal from the antennas for transmission through the interface to the transceiver chip.
Public/Granted literature
- US20170346506A1 MULTI-CHIP MILLIMETER-WAVE INTERFACE Public/Granted day:2017-11-30
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