Invention Grant
- Patent Title: Method of processing sound signal of electronic device and electronic device for same
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Application No.: US15840896Application Date: 2017-12-13
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Publication No.: US10264356B2Publication Date: 2019-04-16
- Inventor: Ki-Won Kim , Han-Ho Ko , Joon-Rae Cho , Ki-Won Kim
- Applicant: Samsung Electronics Co., Ltd.
- Applicant Address: KR
- Assignee: Samsung Electronics Co., Ltd
- Current Assignee: Samsung Electronics Co., Ltd
- Current Assignee Address: KR
- Agency: The Farrell Law Firm, P.C.
- Priority: KR10-2016-0169517 20161213
- Main IPC: H04R3/04
- IPC: H04R3/04 ; H04R3/00 ; H04R29/00
Abstract:
An electronic device is disclosed and includes a sensor module; an audio output module; and a processor configured to apply a preset DC offset to a sound signal provided to the audio output module based on a change in the internal pressure inside the electronic device, detected through the sensor module.
Public/Granted literature
- US20180167732A1 METHOD OF PROCESSING SOUND SIGNAL OF ELECTRONIC DEVICE AND ELECTRONIC DEVICE FOR SAME Public/Granted day:2018-06-14
Information query
