Hot melt adhesives with pressure sensitive adhesive properties for electronic devices are described. The hot melt adhesive comprises a styrenic block copolymer with fully hydrogenated and saturated soft blocks, a liquid diluent or a tackifier, a (meth)acrylate monomer or an oligomer having at least two (meth)acrylic functionalities per oligomer chain, and an initiator. The hot melt adhesive is also a reworkable UV curable optically clear adhesive film. The adhesive and film are suitable as a laminating PSA film or encapsulant for LCD display, LED display, touch screen, and flexible thin film photovoltaic module.