According to one embodiment, an electronic device includes a first substrate, a second substrate and a connecting material. The first substrate includes a first basement and a first conductive layer. The second substrate includes a second basement having a first hole a second conductive layer having a second hole. The first surface of the second basement opposes the first conductive layer and is spaced therefrom. The second surface opposite to the first surface includes a first flat portion exposed from the second conductive layer. The connecting material is filled into the first hole electrically connect the first conductive layer and the second conductive layer to each other.