Invention Grant
- Patent Title: High-resolution electric field sensor in cover glass
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Application No.: US15378897Application Date: 2016-12-14
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Publication No.: US10268864B2Publication Date: 2019-04-23
- Inventor: Richard S. Withers , Ronald B. Koo , Stephen C. Gerber , Arkadii V. Samoilov , David Johnson
- Applicant: QUALCOMM Incorporated
- Applicant Address: US CA San Diego
- Assignee: QUALCOMM TECHNOLOGIES, INC
- Current Assignee: QUALCOMM TECHNOLOGIES, INC
- Current Assignee Address: US CA San Diego
- Agency: Weaver Austin Villeneuve & Sampson LLP
- Main IPC: G01R27/26
- IPC: G01R27/26 ; G06K9/00 ; G06F3/01 ; G02F1/1333 ; H01L27/32 ; H01L51/52

Abstract:
A fingerprint sensor is described that includes a thin protective cover layer on a sensor glass layer with receive circuitry between the thin protective cover layer and the sensor glass layer. In an implementation, a fingerprint sensor assembly includes a controller; a metal layer configured to be electrically coupled to the controller; a transmit layer electrically connected to the metal layer and the controller; a sensor glass layer, where the transmit layer is disposed on a first side of the sensor glass layer, and where the transmit layer is electrically coupled to the controller; a receive layer disposed on a second side of the sensor glass layer, where the receive layer is electrically coupled to the controller; and a protective cover layer disposed on the receive layer.
Public/Granted literature
- US20170091513A1 HIGH-RESOLUTION ELECTRIC FIELD SENSOR IN COVER GLASS Public/Granted day:2017-03-30
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