Invention Grant
- Patent Title: Semiconductor device and method of manufacturing the same
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Application No.: US15624783Application Date: 2017-06-16
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Publication No.: US10269629B2Publication Date: 2019-04-23
- Inventor: Junghun Choi , Jeong Ik Kim , Myung Yang , Chul Sung Kim , Sang Jin Hyun
- Applicant: SAMSUNG ELECTRONICS CO., LTD.
- Applicant Address: KR Suwon-si, Gyeonggi-do
- Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee: SAMSUNG ELECTRONICS CO., LTD.
- Current Assignee Address: KR Suwon-si, Gyeonggi-do
- Agency: Lee & Morse, P.C.
- Priority: KR10-2016-0114022 20160905
- Main IPC: H01L21/768
- IPC: H01L21/768 ; H01L23/528 ; H01L23/535 ; H01L23/485 ; H01L23/532

Abstract:
A semiconductor device and a method of manufacturing the same, the semiconductor device including a substrate; an insulating layer on the substrate, the insulating layer including a first trench and a second trench therein, the second trench having an aspect ratio that is smaller than an aspect ratio of the first trench; a barrier layer in the first trench and the second trench; a seed layer on the barrier layer in the first trench and the second trench; a first bulk layer on the seed layer and filled in the first trench; and a second bulk layer on the seed layer and filled in the second trench, wherein an average grain size of the second bulk layer is larger than an average grain size of the first bulk layer.
Public/Granted literature
- US20180068889A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME Public/Granted day:2018-03-08
Information query
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