Invention Grant
- Patent Title: Anti-reflection layer for back-illuminated sensor
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Application No.: US15668776Application Date: 2017-08-04
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Publication No.: US10269842B2Publication Date: 2019-04-23
- Inventor: Masaharu Muramatsu , Hisanori Suzuki , Yasuhito Yoneta , Shinya Otsuka , Jehn-Huar Chern , David L. Brown , Yung-Ho Alex Chuang , John Fielden , Venkatraman Iyer
- Applicant: KLA-Tencor Corporation , Hamamatsu Photonics K.K.
- Applicant Address: JP Shizuoka US CA Milpitas
- Assignee: Hamamatsu Photonics K.K.,KLA-Tencor Corporation
- Current Assignee: Hamamatsu Photonics K.K.,KLA-Tencor Corporation
- Current Assignee Address: JP Shizuoka US CA Milpitas
- Agency: Bever, Hoffman & Harms, LLP
- Main IPC: H01L27/146
- IPC: H01L27/146

Abstract:
An image sensor for short-wavelength light includes a semiconductor membrane, circuit elements formed on one surface of the semiconductor membrane, and a pure boron layer on the other surface of the semiconductor membrane. An anti-reflection or protective layer is formed on top of the pure boron layer. This image sensor has high efficiency and good stability even under continuous use at high flux for multiple years. The image sensor may be fabricated using CCD (charge coupled device) or CMOS (complementary metal oxide semiconductor) technology. The image sensor may be a two-dimensional area sensor, or a one-dimensional array sensor.
Public/Granted literature
- US20170338257A1 Anti-Reflection Layer For Back-Illuminated Sensor Public/Granted day:2017-11-23
Information query
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