Invention Grant
- Patent Title: Vertical MOS transistor and fabricating method thereof
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Application No.: US15615901Application Date: 2017-06-07
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Publication No.: US10269915B2Publication Date: 2019-04-23
- Inventor: Tai-I Yang , Yung-Chih Wang , Shin-Yi Yang , Chih-Wei Lu , Hsin-Ping Chen , Shau-Lin Shue
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L29/49
- IPC: H01L29/49 ; H01L29/66 ; H01L29/43 ; H01L29/12 ; H01L29/06 ; H01L21/768

Abstract:
A vertical MOS transistor includes a substrate, a metal line disposed on the substrate, a semiconductor pillar disposed on and in contact with the metal line, a gate dielectric layer disposed surrounding the semiconductor pillar, a metal gate disposed surrounding a portion of the semiconductor pillar, and a gate electrode disposed in contact with the metal gate. In some embodiments, a width of an end of the gate electrode in contact with the metal gate is narrower than a width of an end of the gate electrode away from the metal gate.
Public/Granted literature
- US20180308947A1 VERTICAL MOS TRANSISTOR AND FABRICATING METHOD THEREOF Public/Granted day:2018-10-25
Information query
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