Invention Grant
- Patent Title: Method for manufacturing tunnel field effect transistor
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Application No.: US15590243Application Date: 2017-05-09
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Publication No.: US10269934B2Publication Date: 2019-04-23
- Inventor: I-Sheng Chen , Cheng-Hsien Wu , Chih-Chieh Yeh
- Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Applicant Address: TW Hsinchu
- Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.
- Current Assignee Address: TW Hsinchu
- Agency: McClure, Qualey & Rodack, LLP
- Main IPC: H01L29/66
- IPC: H01L29/66 ; H01L29/10 ; H01L27/088 ; H01L21/285

Abstract:
A semiconductor device includes a substrate, at least one first semiconductor layer, and at least one second semiconductor layer. The at least one first semiconductor layer is disposed on the substrate, and the at least one second semiconductor layer is disposed on the at least one first semiconductor layer. The at least one first semiconductor layer includes a first doping portion, a second doping portion, a channel, and a semiconductor film. The second doping portion is adjacent to the first doping portion. The channel is disposed between the first doping portion and the second doping portion, and disposed with the substrate in parallel. The semiconductor film is disposed around the channel.
Public/Granted literature
- US20180277665A1 SEMICONDUCTOR DEVICE AND METHOD FOR FABRICATING THE SAME Public/Granted day:2018-09-27
Information query
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