• Patent Title: Advanced thermally compensated surface acoustic wave device and fabrication
  • Application No.: US14782548
    Application Date: 2014-03-21
  • Publication No.: US10270413B2
    Publication Date: 2019-04-23
  • Inventor: Christophe ZinkeEric Desbonnets
  • Applicant: SOITEC
  • Applicant Address: FR Bernin
  • Assignee: Soitec
  • Current Assignee: Soitec
  • Current Assignee Address: FR Bernin
  • Agency: TraskBritt
  • Priority: FR1300824 20130408
  • International Application: PCT/EP2014/055746 WO 20140321
  • International Announcement: WO2014/166722 WO 20141016
  • Main IPC: H01L41/22
  • IPC: H01L41/22 H03H3/08 H03H9/25
Advanced thermally compensated surface acoustic wave device and fabrication
Abstract:
This disclosure relates to a method of fabrication of a surface acoustic wave device comprising the step (a) of providing a piezoelectric structure, the step (b) of providing a dielectric structure, wherein the step (b) comprises a step (b1) of metalizing the dielectric structure, and the method further comprising the step (c) of bonding the metalized dielectric structure to the piezoelectric structure.
Information query
Patent Agency Ranking
0/0