Invention Grant
- Patent Title: Modulator, modulation system, and method for implementing higher order modulation
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Application No.: US15974489Application Date: 2018-05-08
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Publication No.: US10270632B2Publication Date: 2019-04-23
- Inventor: Lei Liu , Yuanyuan Fang , Shupeng Deng , Chi Yan Wong
- Applicant: Huawei Technologies Co., Ltd.
- Applicant Address: CN Shenzhen
- Assignee: Huawei Technologies Co., Ltd.
- Current Assignee: Huawei Technologies Co., Ltd.
- Current Assignee Address: CN Shenzhen
- Main IPC: H04B10/50
- IPC: H04B10/50 ; H04L27/20 ; G02F1/00 ; H04B10/588 ; H04B10/25 ; H04L27/00 ; H04L27/26 ; G02F1/225

Abstract:
Embodiments of the present disclosure disclose a modulator, including: a first modulation module, configured to: receive first to-be-modulated data, and output a first transmission curve according to the first to-be-modulated data; a second modulation module, configured to: receive second to-be-modulated data, and output a second transmission curve according to the second to-be-modulated data, where a period of the second transmission curve is half of a period of the first transmission curve; and a combination module, configured to perform phase superposition on the first transmission curve and the second transmission curve, to obtain a combined linear result. In addition, this solution further provides a modulation system and a method for implementing higher order modulation, so that a linear result that can be modulated can be obtained by controlling a superposition ratio between transmission curves, to implement linear curve transmission.
Public/Granted literature
- US20180262376A1 MODULATOR, MODULATION SYSTEM, AND METHOD FOR IMPLEMENTING HIGHER ORDER MODULATION Public/Granted day:2018-09-13
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