Invention Grant
- Patent Title: Chip resistor
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Application No.: US15764570Application Date: 2016-09-26
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Publication No.: US10276285B2Publication Date: 2019-04-30
- Inventor: Kentaro Matsumoto
- Applicant: KOA Corporation
- Applicant Address: JP Ina-shi
- Assignee: KOA Corporation
- Current Assignee: KOA Corporation
- Current Assignee Address: JP Ina-shi
- Agency: Crowell & Moring LLP
- Priority: JP2015-194663 20150930
- International Application: PCT/JP2016/078225 WO 20160926
- International Announcement: WO2017/057248 WO 20170406
- Main IPC: H01C1/142
- IPC: H01C1/142 ; H01C1/148 ; H01C7/00 ; H01C1/012 ; H01C17/00 ; H01C17/28

Abstract:
Provided is a chip resistor including: a rectangular parallelepiped insulating substrate which is made of ceramics; a pair of front electrodes which are provided on lengthwise opposite end portions in a front surface of the insulating substrate; a resistive element which is provided between and connected to the two front electrodes; a protective layer which is made of a resin and which entirely covers the front surface of the insulating substrate including the two front electrodes and the resistive element; and a pair of cap-shaped end-surface electrodes which are provided on the lengthwise opposite end portions of the insulating substrate to establish electrical continuity to the front electrodes respectively; wherein: a chip element assembly in which the insulating substrate and the protective layer are laminated on each other but the end-surface electrodes have not been formed yet has an external shape substantially like a square cylinder.
Public/Granted literature
- US20180286541A1 Chip Resistor Public/Granted day:2018-10-04
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