发明授权
- 专利标题: Thin wafer shipper
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申请号: US15269368申请日: 2016-09-19
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公开(公告)号: US10276414B2公开(公告)日: 2019-04-30
- 发明人: Barry Gregerson , Jason Todd Steffens , Russ V. Raschke
- 申请人: Entegris, Inc.
- 申请人地址: US MA Billerica
- 专利权人: Entegris, Inc.
- 当前专利权人: Entegris, Inc.
- 当前专利权人地址: US MA Billerica
- 代理机构: Entegris, Inc.
- 主分类号: H01L21/673
- IPC分类号: H01L21/673
摘要:
An improved wafer support mechanism in a wafer container useful for carrying a plurality of axially aligned thin mostly circular wafer substrates. The container includes a cassette that has a plurality of adjacently disposed teeth for receiving the substrates, wherein each rib member is continuous from the cassette open top to the cassette open bottom, a removable top cover portion, a removable bottom cover portion, a cushion assembly removably attached to the container top cover, and another cushion assembly removably located in the container bottom cover and held in place by the weight of the wafer cassette. The top cushions are formed of individual segments having an extended lead-in feature at the end of each segment, spring sections in each segment and each segment has a V-shaped cross section to receive the wafer edge. The top and bottom cushions are installed in the top and bottom container covers, respectively, and extend the wafer support to approximately the entire circumference of each wafer.
公开/授权文献
- US20170062253A1 THIN WAFER SHIPPER 公开/授权日:2017-03-02