- 专利标题： Pick and place device with interdigitated electrodes for micro scale device
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申请号： US15183608申请日： 2016-06-15
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公开(公告)号： US10276419B1公开(公告)日： 2019-04-30
- 发明人: Hyeun-Su Kim , Dariusz Golda , John A. Higginson
- 申请人： Apple Inc.
- 申请人地址： US CA Cupertino
- 专利权人： Apple Inc.
- 当前专利权人： Apple Inc.
- 当前专利权人地址： US CA Cupertino
- 代理机构： Jaffery Watson Mendonsa & Hamilton LLP
- 主分类号： H01L21/683
- IPC分类号： H01L21/683 ; B81C99/00 ; H02N13/00 ; B25J15/00
摘要：
A compliant electrostatic transfer head and array are described. In an embodiment a compliant electrostatic transfer head includes a base substrate, and a plurality of interdigitated spring electrodes that are deflectable together into a cavity toward the base substrate. Each spring electrode includes mesa structure, and the mesa structures of the plurality of interdigitated spring electrodes are aligned.
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